Ramtron International has announced plans to install its F-RAM semiconductor process technology in IBM's Vermont advanced wafer manufacturing facility. The new foundry is expected to serve as a "foundation" for the introduction of high-performance F-RAM semiconductor products.
"This agreement with IBM complements our existing relationships with Texas Instrument and Fujitsu. Initial products to be built on the IBM line will be new F-RAM devices, including products from our FRID product initiative currently under development," Ramtron spokesperson Lee Brown told IT Examiner.
"This is a pure foundry services arrangement with IBM and does not include a license for IBM to use Ramtron's F-RAM technology. Our existing relationships with TI and Fujitsu included an F-RAM license in addition to the foundry support they provide for Ramtron," added Brown.
Ramtron COO Bob Djokovich explained that the factory's upgraded manufacturing capacity would help meet increased demands for F-RAM semicondutor products.
"This new world-class foundry will provide a flexible and cost effective manufacturing platform for our new product development initiatives, which will drive new market opportunities for Ramtron. We have high confidence in IBM Microelectronics and believe that the addition of their process development and foundry services will help Ramtron serve the future needs of F-RAM customers around the world," said Djokovich.
John DiToro, an IBM VP, explained that the vast array of IP blocks available via IBM's foundry services would provide Ramtron with "product development flexibility."
Ramtron plans to initiate the first production of wafers in 2010 utilising IBM's 0.18-micron manufacturing process
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